HomeSIGGRAPH Asia 2026 CommitteeTechnical Communications and Posters Committee

Technical Communications and Posters Committee

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Posters Chair

Peng Song
Singapore University of Technology and Design
Singapore

Technical Communications Chair

Qi Sun
New York University
United States of America

Technical Communications & Posters Committee

Akshay Jindal
Intel Corporation
United States of America
Alma Cantu
Newcastle University
United Kingdom
Amal Dev Parakkat
Institut Polytechnique de Paris
France
Andreas A. Vasilakis
Athens University of Economics & Business
Greece
Andrew Chalmers
Victoria University of Wellington, Computational Media Innovation Centre
New Zealand
Anjul Patney
NVIDIA
United States of America
Binh-Son Hua
Trinity College Dublin
Ireland
Bohan Wang
National University of Singapore
Singapore
Cal Chiu
Unity Technologies
Japan
Cara Tursun
Switzerland
Cheng Xu
Singapore Management University
Singapore
Colin Groth
New York University
United States of America
Daljit Singh J.S. Dhillon
Clemson University
United States of America
Danielle An
Meta
United Kingdom
Davide Pellis
ISTI – CNR
Italy
Eric Patterson
Clemson University
United States of America
Federico Iuricich
Clemson University
United States of America
Fukusato Tsukasa
Waseda University
Japan
Guoxin Fang
Chinese University of Hong Kong, Centre for Perceptual and Interactive Intelligence (CPII) Limited
Hong Kong
Haisen Zhao
Shandong University
China
Haoran Xie
Japan Advanced Institute of Science and Technology (JAIST), Waseda University
Japan
Hijung Shin
Adobe Inc.
United States of America
Huangying Zhan
Goertek Alpha Labs
United States of America
HyeongYeop Kang
Korea University
South Korea
Hyowon Lee
School of Computing, Dublin City University Glasnevin
Ireland
Hyunsung Cho
Carnegie Mellon University
United States of America
Johanna Delanoy
Institut National des Sciences Appliquées (INSA) de Lyon
France
Jonghyun Kim
NVIDIA
United States of America
Juan Miguel de Joya
Autodesk
Switzerland
Julian Panetta
University of California Davis
United States of America
Julio Marco
Universidad de Zaragoza
Spain
Ka-Hei Hui
Chinese University of Hong Kong, Autodesk Research
Canada
Kai Wang
Simon Fraser University, ShanghaiTech University
Canada
Kan Chen
Singapore Institute of Technology
Singapore
Ke Chen
University of Science and Technology of China, Singapore University of Technology and Design
China
Ke Ma

Snap

United States of America
Keke Tang
Guangzhou University
China
Lauren Buck
Trinity College Dublin
Ireland
Li Jiang
The Chinese University of Hong Kong (Shenzhen), Shenzhen Loop Area Institute
China
Liang Shi
Massachusetts Institute of Technology (MIT)
United States of America
Luca Surace
Independent
Italy
Michal Piovarci
Foundation LLM Technologies Inc
Slovakia
Mina Konakovic Lukovic
Massachusetts Institute of Technology (MIT)
United States of America
Mine Dastan
Polytecnic University of Bari
Italy
Minhyuk Sung
Korea Advanced Institute of Science and Technology (KAIST)
South Korea
Niall Williams
Barnard College
United States of America
Nobuyuki Umetani
University of Tokyo
Japan
Peng Song
Singapore University of Technology and Design (SUTD)
Singapore
Pengfei Xu
Shenzhen University (SZU)
China
Peter Yichen Chen
The University of British Columbia
Canada
Qingnan Zhou
Adobe
United States of America
Quentin Becker
The University of Tokyo hnologies Inc
Japan
Rulin Chen
Beijing Normal–Hong Kong Baptist University
China
Siqi Li
Singapore University of Technology and Design (SUTD)
Singapore
Stavros Diolatzis
Intel Corporation
France
Tong Wu
Stanford University
Hong Kong
Wei Zeng
The Hong Kong University of Science and Technology (Guangzhou), The Hong Kong University of Science and Technology
China
Weidan Xiong
Shenzhen University, College of Computer Science and Software Engineering
China
Xian Xu
Lingnan University
Hong Kong
Xihui Liu
University of Hong Kong
Hong Kong
Xinxing Xia
Shanghai University, Shangda General Intelligent Robotics Research Institute
China
Yangyang Xu
Harbin Institute of Technology (Shenzhen)
China
Yingsi Qin
Carnegie Mellon University
United States of America
Yuki Koyama
The University of Tokyo
Japan
Yukun Lu
University of Science and Technology of China, Singapore University of Technology and Design
China
Zhangjin Huang
University of Science and Technology of China
China
Zhengzhe Liu
Lingnan University
China
Ziqi Wang
HKUST
China