BEGIN:VCALENDAR VERSION:2.0 PRODID:Linklings LLC BEGIN:VTIMEZONE TZID:Asia/Tokyo X-LIC-LOCATION:Asia/Tokyo BEGIN:STANDARD TZOFFSETFROM:+0900 TZOFFSETTO:+0900 TZNAME:JST DTSTART:18871231T000000 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20250110T023313Z LOCATION:Hall B5 (1)\, B Block\, Level 5 DTSTART;TZID=Asia/Tokyo:20241206T152700 DTEND;TZID=Asia/Tokyo:20241206T154100 UID:siggraphasia_SIGGRAPH Asia 2024_sess148_papers_528@linklings.com SUMMARY:ThermOuch: A Wearable Thermo-Haptic Device for Inducing Pain Sensa tion in Virtual Reality through Thermal Grill Illusion DESCRIPTION:Technical Papers\n\nHaichen Gao (City University of Hong Kong) , Shaoyu Cai (National University of Singapore), and Yuhong Wu and Kening Zhu (City University of Hong Kong)\n\nExisting research showed that unplea sant haptic feedback, such as pain, could enhance the user experience and performance in various scenarios (e.g. entertainment and training). This p aper introduces ThermOuch, a wearable thermohaptic device that leverages t he thermal grill illusion (TGI) to simulate pain sensations in virtual rea lity (VR) without causing actual invasive/non-invasive harm. Our results o f the user-perception experiments revealed that higher temperature-changin g rates, particularly with increased warming, were associated with more in tense pain perceived by the participants through our system. Furthermore, a higher ratio of warm-to-cool temperature transitions reduced the sensati on of coldness prior to pain. Our experiments also showed that introducing an additional stimulus unit potentially heightened pain perception, and a ltering the spacing between stimulus units modified the perceived pain are a. Lastly, the user study in VR demonstrated that ThermOuch significantly enhanced the sense of presence and body ownership for the participants, as well as elevated their biosignal-indicated arousal levels.\n\nRegistratio n Category: Full Access, Full Access Supporter\n\nLanguage Format: English Language\n\nSession Chair: Peng Song (Singapore University of Technology and Design (SUTD)) URL:https://asia.siggraph.org/2024/program/?id=papers_528&sess=sess148 END:VEVENT END:VCALENDAR