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VERSION:2.0
PRODID:Linklings LLC
BEGIN:VTIMEZONE
TZID:Asia/Tokyo
X-LIC-LOCATION:Asia/Tokyo
BEGIN:STANDARD
TZOFFSETFROM:+0900
TZOFFSETTO:+0900
TZNAME:JST
DTSTART:18871231T000000
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BEGIN:VEVENT
DTSTAMP:20260817T171539Z
LOCATION:G510\, G Block\, Level 5
DTSTART;TZID=Asia/Tokyo:20241205T163000
DTEND;TZID=Asia/Tokyo:20241205T173000
UID:siggraphasia_SIGGRAPH Asia 2024_sess263_bof_123@linklings.com
SUMMARY:Digging into the Technical Papers (In Japanese) 『テクニカルペーパーを知る』(DAY
 3)
DESCRIPTION:Yuki Igarashi (Ochanomizu University) and Hideki Todo (Takusho
 ku University)\n\nA commentary and discussion of SIGGRAPH Asia 2024 Techni
 cal Paper by a panel of experts. It will consist of research impression, b
 ackground and its significance. Only available on-site in Japanese.\n\n今回発
 表されるテクニカルペーパーの内容について、国内の専門家が日本語で解説します。 研究の背景や意義、第三者から見た印象などを含めたオフラインならではのト
 ークを予定しています。\n\n<a href="https://diggingtechpapers.github.io/">https://digg
 ingtechpapers.github.io/</a>\n\nRegistration Category: Enhanced Access, Ex
 hibit & Experience Access, Experience Hall Exhibitor, Full Access, Full Ac
 cess Supporter, Trade Exhibitor\n\nLanguage Format: Japanese Language, Eng
 lish Language\n\n
URL:https://asia.siggraph.org/2024/program/?id=bof_123&sess=sess263
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