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DTSTAMP:20260817T171530Z
LOCATION:Hall B5 (1)\, B Block\, Level 5
DTSTART;TZID=Asia/Tokyo:20241206T152700
DTEND;TZID=Asia/Tokyo:20241206T154100
UID:siggraphasia_SIGGRAPH Asia 2024_sess148_papers_528@linklings.com
SUMMARY:ThermOuch: A Wearable Thermo-Haptic Device for Inducing Pain Sensa
 tion in Virtual Reality through Thermal Grill Illusion
DESCRIPTION:Haichen Gao (City University of Hong Kong), Shaoyu Cai (Nation
 al University of Singapore), and Yuhong Wu and Kening Zhu (City University
  of Hong Kong)\n\nExisting research showed that unpleasant haptic feedback
 , such as pain, could enhance the user experience and performance in vario
 us scenarios (e.g. entertainment and training). This paper introduces Ther
 mOuch, a wearable thermohaptic device that leverages the thermal grill ill
 usion (TGI) to simulate pain sensations in virtual reality (VR) without ca
 using actual invasive/non-invasive harm. Our results of the user-perceptio
 n experiments revealed that higher temperature-changing rates, particularl
 y with increased warming, were associated with more intense pain perceived
  by the participants through our system. Furthermore, a higher ratio of wa
 rm-to-cool temperature transitions reduced the sensation of coldness prior
  to pain. Our experiments also showed that introducing an additional stimu
 lus unit potentially heightened pain perception, and altering the spacing 
 between stimulus units modified the perceived pain area. Lastly, the user 
 study in VR demonstrated that ThermOuch significantly enhanced the sense o
 f presence and body ownership for the participants, as well as elevated th
 eir biosignal-indicated arousal levels.\n\nRegistration Category: Full Acc
 ess, Full Access Supporter\n\nLanguage Format: English Language\n\nSession
  Chair: Peng Song (Singapore University of Technology and Design (SUTD))\n
 \n
URL:https://asia.siggraph.org/2024/program/?id=papers_528&sess=sess148
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